Type analysis of package substrates for high power LEDs

For a long time, the display application has been the primary focus of the LED, the LED for the heat requirements of the situation is not very high, the resin using a conventional multi-LED package substrate.

After 2000, with the development of LED high-luminance and high-efficiency technology, coupled with the significant improvement of blue LED luminous efficiency, LED manufacturing costs continue to decline, so that the scope of LED applications and the willingness to adopt LED industry will continue to expand. Including LCD, home appliances, automotive and other companies, they are also actively considering the possibility of applying LEDs. For example, consumers expect high-power LEDs to achieve power saving, high brightness, long life and high color reproducibility. This represents the ability to achieve high heat dissipation and is an indispensable condition for high-power LED package substrates.

In addition, the LCD panel industry faces the EU RoHS regulations, and it is necessary to face the environmental pressure of completely non-silvering of cold cathode lamps, which has made the market demand for high-power LEDs more urgent.

In addition to protecting the internal LED chip , the LED package also has the functions of electrical connection and heat dissipation between the LED chip and the outside.

Epoxy properties are no longer in line with high power LED requirements

One LED can reach several hundred lumens, which is basically not a big problem. The main problem is how to deal with heat dissipation? Next, after generating such a large lumen, how to maintain the stability and continuity of brightness, this is another important topic. If the heat treatment is not done well, the brightness and life of the LED will drop rapidly. For LED, how It is very important to achieve effective reliability and heat transfer.

In the past, LEDs were packaged using low thermal conductivity resins, but this is considered to be one of the causes of heat dissipation characteristics. In addition, the heat resistance of epoxy resins is relatively poor, and it may happen that the life of the LED chips themselves is not Before the arrival, the epoxy resin has been discolored, so improving heat dissipation is an important key.

In addition, not only the thermal phenomenon will change the epoxy resin, but even the short wavelength will cause problems for the epoxy resin. This is because the white LED light spectrum also contains short-wavelength light, while the epoxy resin is equivalent. It is easily damaged by short-wavelength light in white LEDs. Even low-power white LEDs can make epoxy resin damage more serious. Moreover, high-power white LEDs emit more short-wavelength light, which is more natural than low-power models. Fast, even some products have a service life of only 5,000 hours or even shorter after continuous lighting. Therefore, instead of constantly overcoming the discoloration caused by the old packaging material “epoxy resin”, it is better to seek new packaging materials for the next generation.

Epoxy resin has poor heat resistance

Figure 1: Epoxy resin has poor heat resistance, and the epoxy resin has changed color before the life of the LED chip itself reaches.

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