STMicroelectronics, a global leader in the semiconductor industry, has introduced a groundbreaking TO-220 FullPAK (TO-220FP) power transistor package with an extended creepage distance. This innovative design is particularly useful in high-voltage applications, such as those found in TVs and PCs, where dust accumulation can lead to dangerous arc discharges between power transistor pins.
The TO-220FP package features a wide creepage pitch of 4.25mm, which significantly improves safety by reducing the risk of electrical arcing. Traditional packages with a 2.54mm lead spacing often require additional protective measures like potting or sealing. However, this new design eliminates the need for these extra steps, streamlining the manufacturing process and improving efficiency.
Beyond its superior arc protection, the TO-220FP retains the excellent electrical performance of the standard TO-220FP package. Its similar form factor ensures compatibility with existing installation processes, making it easier for manufacturers to integrate into their current systems without major modifications.
This advanced package was developed in collaboration with SoluM, a leading South Korean power supply manufacturer. SoluM is leveraging this technology to create more reliable and cost-effective power solutions that outperform competitors in both performance and value.
STMicroelectronics' TO-220FP wide creepage power transistors are currently in the final stages of mass production preparation. They are being used by a global top-tier TV manufacturer to develop next-generation products. The new family includes four fully qualified MDmeshâ„¢ M2 MOSFETs with low on-resistance (RDS(ON)) ratings from 8A to 34A at 600V. Additionally, the 1500V STFH12N150K5 and 1200V STFH12N120K5 MDmesh K5 devices are expected to undergo certification testing before the end of Q3 2016.
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