Passive intermodulation (PIM) is a critical issue in wireless communication systems, where increasing demands for voice and data transmission require efficient use of limited bandwidth. PIM arises when signals of different frequencies interact nonlinearly within passive components, generating unwanted spurious signals. These signals can fall into the receiver's frequency band, causing desensitization and degrading call quality or reducing the carrier-to-interference ratio (C/I), which limits system capacity.
PIM can be caused by various factors such as poor mechanical contacts, iron-containing materials in RF paths, and surface contamination. Predicting PIM values accurately is challenging, and measurements are often used to estimate device performance. Minor changes in design can significantly affect PIM levels, prompting manufacturers to perform 100% testing on RF components used in base stations.
In high-power transmission channels, multiple frequencies can lead to intermodulation distortion. This article focuses specifically on integrated cables, which exhibit both directional and frequency-dependent PIM characteristics that influence their performance in base stations.
To test PIM in integrated cables, specialized equipment like the Summitek SI-1900A analyzer is used. It measures both forward and reverse PIM responses simultaneously, eliminating the need for reconnection and minimizing measurement errors. This feature allows for comprehensive PIM analysis of the cable.
The model presented in Figure 2 illustrates how reflection and through intermodulation occur in an integrated cable. The key assumption is that only the connectors produce significant PIM, while the cable itself contributes mainly to loss and group delay. Using this model, engineers can better understand and predict the behavior of PIM in real-world scenarios.
By analyzing the third-order intermodulation formulas, it becomes possible to predict how PIM sources interact within the system. Assumptions such as a lossless cable help simplify calculations, although real-world conditions may introduce variations. The model also accounts for phase shifts and group delays, making it more accurate in predicting PIM behavior.
Testing with the SI-1900A confirmed the model’s predictions, showing a close match between theoretical and measured results. However, discrepancies were observed due to simplifications in the model, such as equal amplitude PIM sources and idealized assumptions about cable loss and positioning.
In conclusion, the simplified PIM model effectively predicts both reflection and through intermodulation. Understanding these effects helps engineers optimize system performance, especially in environments where PIM can impact signal integrity. The principles discussed apply not only to integrated cables but also to any two-port RF device, offering valuable insights for system design and troubleshooting.
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The HV power module is also equipped with a DB9 interface to facilitate the bus control of embedded installation equipment. Customers can apply 0-10V signals and dry contact signals to the interface according to our interface definition to achieve comprehensive control and monitoring functions on the power supply, like high voltage start / stop, output setting and reading.
The CCP1000 high voltage power modules are equipped with complete protection functions, which can deal with sparking, short-circuit, and overload conditions. With the discharge protection circuit recommended by iDealTek-Electronics, the high-voltage module can also cope with conventional capacitor charging and discharging conditions.
At present, the high voltage power modules are mainly used in air or oil fume purification, capacitor charging and other application fields that require a high-voltage power module that can be embedded installation.
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