The Clad/Cladding coating is a thin layer of metal coated on the appearance of other materials. As a protective cover or other function, the substrate on the circuit board is covered with copper foil on the substrate board. Therefore, the formal name should be “copper. Copper Clad Laminates (CCL), which mainlanders call it "CCL," are used by Taiwanese manufacturers as "copper substrates."
I-CLAMP (Quick Wire Connector)
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