Last month, Shenzhen Jingtai Optoelectronics Co., Ltd. "Drive High Efficiency Light" product promotion meeting was successfully held in Guangzhou. At the meeting, Jingtai Optoelectronics comprehensively exhibited LED packaging cutting-edge technology and the latest device products in the three major areas of LED lighting, full-color display series and 3C series, which attracted a large number of new and old customers to participate.
Founded in 2008, Jingtai Optoelectronics is a high-tech enterprise specializing in the R & D and production of SMDLEDs and high-power LEDs. Its product positioning is in the mid-to-high-end LED application market, focusing on LED packaging technology and manufacturing.
As of the end of 2012, the area of ​​Jingtai Optoelectronics production base reached 12,000 square meters, with nearly 800 employees. In 2012, the company's total output value exceeded 300 million yuan. "The company plans to achieve an annual output value of 1 billion yuan by 2015." Zhang Yuan, Marketing Director of Jingtai Optoelectronics, said at the promotion meeting.
According to Zhang Yuan, Jingtai Optoelectronics introduced foreign advanced ASM automatic crystal bonding machine, automatic wire bonding machine, molding machine, automatic cutting machine, SMDLED automatic beam splitter, SMDLED automatic tape loading machine, environmental testing machine, high-precision optical analysis There are more than 600 machines of world-class automatic production line such as system, computer analysis microscope and so on.
"At present, the monthly production capacity has exceeded 1000KK / month. The company has continuously made new breakthroughs in the research and development of high-efficiency COB-MLCOB, small-size power EMC light sources and cost-effective COB light source solutions. The overall production and operation scale is in the forefront of the domestic packaging industry." Zhang Yuan said.
Complete packaging products, unique design, leading peers
In this promotion meeting, Jingtai Optoelectronics displayed a full range of COB products represented by the new MLCOB (third-generation COB packaging technology), including high-power LEDs, medium-power LEDs and other devices used in lighting products. As the third generation packaging technology, MLCOB's biggest advantage is that it can effectively improve the light efficiency.
Jingtai Optoelectronics Zhang Lei said that the current luminous efficiency of MLCOB products in mass production is 160lm / w, and the data in the laboratory exceeds 200lm / w. At the same time, MLCOB takes into account other advantages of COB. For example, with good heat dissipation, the thermal resistance of MLCOB can reach 5 ℃ / W, which is convenient for installation and has no thermal damage.
"The difference from traditional COB is that MLCOB has a unique reflector design and uses secondary optical processing of polygonal prisms. These two technologies combined with the comprehensive application of traditional COB technology make the light efficiency of MLCOB products improve on the traditional basis. 30% -40%. "Zhang Lei said that MLCOB focuses on the high-end market, and the main demand for LED lighting applications in the future will focus on high luminous efficiency, high reliability, and high heat dissipation.
Jing Mao Optoelectronics R & D Director Zhang Maoneng pointed out at the presentation that the current factors affecting the entry of LED products into indoor lighting include price, reliability, standards and performance.
At the meeting, he also introduced EMCLED (EpoxyMoldingCompoundLED) products, including 2835, 3014, 3020, 3030 four mainstream market specifications devices.
Among them, the medium power 2835 product has a new packaging structure, with a heat sink design; can achieve 0.2w, 0.5w medium and high power product packaging; high light efficiency and high brightness, the display light effect can reach 120lm / w; small size, LED product arrangement It can be more dense, and the effect of applying light more uniformly.
Ten trends of LED packaging technology
At the promotion meeting, Gong Wen, general manager of Jingtai Optoelectronics, summarized the ten trends and hot spots of domestic LED packaging technology in the future:
1. Medium power has become the mainstream packaging method. At present, most products on the market are high-power LED products or low-power LED products. Although they have their own advantages, they also have insurmountable defects. The mid-power LED products that combine the advantages of the two have emerged and become the mainstream packaging method.
2. The application of new materials in packaging. Due to the higher and better environmental resistance such as high temperature resistance, UV resistance and low water absorption, thermosetting materials EMC, thermoplastic PCT, modified PPA and ceramic-like plastics will be widely used.
3. Application of chip super current density. In the future, the chip super-current density will grow from 350MA / mm2 to 700MA / mm2 or even higher. The demand voltage of the chip will be lower, a smoother VI curve (low heat generation), and both ESD and VF.
4. Popularization of COB applications. With the advantages of low thermal resistance, good light type, solder-free and low cost, COM applications will be widely popular in the future.
5. Demand for higher light quality. Mainly for indoor lighting, Jingtai Optoelectronics will use the LED indoor lighting product RA to reach 80 as the standard and RA to reach 90 as the goal. Try to make the light color of the lighting product close to the Planck curve so that the light can be uniform and glare-free .
6. International and domestic standards have been further improved. I believe that with the continuous improvement of LED packaging technology, domestic and international quality standards for LED products will continue to improve.
7. The integrated packaged light engine becomes the package value. The integrated packaged light engine will be the focus of R & D in the next quarter.
8. Power-off solution (high voltage LED). In the future, indoor lighting will pay more attention to quality, and driven by cost factors, the de-powering solution will gradually become an acceptable product, and high-voltage LEDs fully cater to the de-powering solution, but what needs to be solved is that the chip reliability needs to be strengthened.
9. Multi-color LED light source suitable for scene lighting. Scene lighting will be the core competitiveness of LED lighting, and the second take-off of LED lighting in the future will need to rely on scene lighting to achieve.
10. The demand for light efficiency is relatively reduced, and the price-performance ratio has become a magic weapon for packaging factories to win. In the future, indoor lighting will not pay too much attention to light efficiency, but will pay more attention to the quality of light. With the improvement of packaging technology, the cost of LED lamps has been reduced to replace traditional lighting sources. In the process of entering home lighting, the cost performance will be more and more valued by customers.
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