On June 7, 2012, the Silan Micro-Conference reviewed and approved the 2013 Project (Project) on the application of the National Science and Technology Major Project “Major-scale Integrated Circuit Manufacturing Equipment and Complete Process†and the provision of self-raised funds.
On January 21, 2013, the company received the notice of the “Special Project for the 2013 Special Project of 2013†​​issued by the Implementation Management Office of the “Most Large-Scale Integrated Circuit Manufacturing Equipment and Complete Process†(hereinafter referred to as “02 Special Projectâ€) of the Ministry of Science and Technology. 》(ZX02[2012] No. 020) (hereinafter referred to as “Noticeâ€) and its Annex 2 (“Great Scale Integrated Circuit Manufacturing Equipment and Complete Process†National Science and Technology Major Project 2013 Project (Question) List and Central Budget Budget Checklist 》, hereinafter referred to as “listâ€), the project led by the company to “integrate technology for manufacturing and packaging of smart sensor products for mobile terminals and the Internet of Things†has been approved.
The above projects are jointly undertaken by Silan Micro and its holding subsidiary Hangzhou Silan Integrated Circuit Co., Ltd. (hereinafter referred to as “Shrimp Integrationâ€) and other third parties. According to the list of the notice, the company and the holding subsidiary Shilan are integrated in the above-mentioned project central budget approved capital budget as follows:
The above amount has not been received yet.
On January 21, 2013, the company received the notice of the “Special Project for the 2013 Special Project of 2013†​​issued by the Implementation Management Office of the “Most Large-Scale Integrated Circuit Manufacturing Equipment and Complete Process†(hereinafter referred to as “02 Special Projectâ€) of the Ministry of Science and Technology. 》(ZX02[2012] No. 020) (hereinafter referred to as “Noticeâ€) and its Annex 2 (“Great Scale Integrated Circuit Manufacturing Equipment and Complete Process†National Science and Technology Major Project 2013 Project (Question) List and Central Budget Budget Checklist 》, hereinafter referred to as “listâ€), the project led by the company to “integrate technology for manufacturing and packaging of smart sensor products for mobile terminals and the Internet of Things†has been approved.
The above projects are jointly undertaken by Silan Micro and its holding subsidiary Hangzhou Silan Integrated Circuit Co., Ltd. (hereinafter referred to as “Shrimp Integrationâ€) and other third parties. According to the list of the notice, the company and the holding subsidiary Shilan are integrated in the above-mentioned project central budget approved capital budget as follows:
The above amount has not been received yet.
The products have a high share in China, and also used for INDUCTOTHERM,ELECTROTHERM,MEGATHERM,PILLAR,SUPERHEAT,ABP , Mitsubishi electric, Fuji, the United States Yingda equipment and other manufacturers of induction Furnace.
Damping and Absorption Capacitors
MKP Capacitor,MKP Capacitor 0.15UF,MKP Capacitor 20UF,MKP Capacitors 0.22UF
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