In the third quarter, the semiconductor peak season was not prosperous, and even the trend of the peak season was gradually established. However, in the year of capital expenditure, the semiconductor manufacturers did not seem to have much change, including UMC, Riyueguang, and counterfeit products, which remained unchanged, even if TSMC The reduction in capital expenditure by about 5% was not significant, mainly due to a slight decrease in the 65-nm expansion. UMC plans to strengthen its 28/40-nanometer advanced process competitiveness. Both ASE, and the counterfeit products will continue to lay out the copper wire-bonding packaging process. The momentum for capital demand is still there.
Taiwan Semiconductor Manufacturing Co., Ltd. took the lead in lowering its capital expenditures, and revised the original planned capital expenditure limit for 2011 to about 5%, from US$7.8 billion to US$7.4 billion. The reduction was mainly used to expand the 65-nanometer manufacturing process. UMC did not follow up. Instead, it had to use this wave of economic corrections to strengthen its competitiveness and meet the next wave of growth. It decided to maintain its annual capital expenditure plan of US$1.8 billion. Due to the close relationship between UMC and its 65-nm customer, it is expected to generate demand for 40- and 28-nm processes soon. It is expected that the sales revenue of 40nm will be 10% before the end of 2011, and 28nm will also enter the trial production stage soon. .
The growth rate of the 3rd quarter of the packaging and testing industry was better than that of the foundry industry. Despite the conservative view of the 3rd quarter, there is still room for growth in the copper foil packaging market pie. , still need to see the market conditions in the fourth quarter to confirm whether to adjust capital expenditures.
Among them, the annual capital expenditure of defective products is still maintained at the NT$10 billion level. In the third quarter, it will increase 270 wire-binding machines. The Suzhou plant will be in 2011. U half to the first half of 2012 to add an additional 510 line machine. After converting to the copper wire process, the material cost will decline, but the unit price will be slippery, and the initial estimate will be reduced by 10% to 15%. Therefore, it is necessary to increase the production capacity and equipment replacement to increase the production efficiency and increase the communication FCCSP package. Capacity, and the final capital expenditure exceeds the planned amount is very high.
In terms of both solar and moonlight, due to the unabated demand from customers for converting copper processes, it is estimated that the revenue of copper process in the third quarter will continue to increase, which will increase by 20% to 25% compared with the second quarter. In response to customer demand, Riyueguang added 400 wire machine in July. Whether or not it will continue to increase in August and September still requires observation. According to the current situation of orders, Q4 results are still expected to grow faster than Q3. However, the current market is changing rapidly. The actual situation is yet to be confirmed. The capital expenditure in 2011 will remain unchanged at 750 million U.S. dollars. After the visibility is more clear, make adjustments.
Taiwan Semiconductor Manufacturing Co., Ltd. took the lead in lowering its capital expenditures, and revised the original planned capital expenditure limit for 2011 to about 5%, from US$7.8 billion to US$7.4 billion. The reduction was mainly used to expand the 65-nanometer manufacturing process. UMC did not follow up. Instead, it had to use this wave of economic corrections to strengthen its competitiveness and meet the next wave of growth. It decided to maintain its annual capital expenditure plan of US$1.8 billion. Due to the close relationship between UMC and its 65-nm customer, it is expected to generate demand for 40- and 28-nm processes soon. It is expected that the sales revenue of 40nm will be 10% before the end of 2011, and 28nm will also enter the trial production stage soon. .
The growth rate of the 3rd quarter of the packaging and testing industry was better than that of the foundry industry. Despite the conservative view of the 3rd quarter, there is still room for growth in the copper foil packaging market pie. , still need to see the market conditions in the fourth quarter to confirm whether to adjust capital expenditures.
Among them, the annual capital expenditure of defective products is still maintained at the NT$10 billion level. In the third quarter, it will increase 270 wire-binding machines. The Suzhou plant will be in 2011. U half to the first half of 2012 to add an additional 510 line machine. After converting to the copper wire process, the material cost will decline, but the unit price will be slippery, and the initial estimate will be reduced by 10% to 15%. Therefore, it is necessary to increase the production capacity and equipment replacement to increase the production efficiency and increase the communication FCCSP package. Capacity, and the final capital expenditure exceeds the planned amount is very high.
In terms of both solar and moonlight, due to the unabated demand from customers for converting copper processes, it is estimated that the revenue of copper process in the third quarter will continue to increase, which will increase by 20% to 25% compared with the second quarter. In response to customer demand, Riyueguang added 400 wire machine in July. Whether or not it will continue to increase in August and September still requires observation. According to the current situation of orders, Q4 results are still expected to grow faster than Q3. However, the current market is changing rapidly. The actual situation is yet to be confirmed. The capital expenditure in 2011 will remain unchanged at 750 million U.S. dollars. After the visibility is more clear, make adjustments.
Fenghua Jade Motor Co., Ltd. , http://www.telephone-enclosure.com