ITRI ​​held a press conference on key issues of the top ten ICT industry in 2014 yesterday (17th). About this year's IC industry trends, IEK industry analyst Peng Maorong (see photo) pointed out that with the wider application of the Internet of Things (IoT) in the future, it is expected to create new outlets for sensors, power management ICs and other products. Since the above products are all relatively mature processes, it is expected that Taiwan's wafer foundry 8-inch factory capacity will remain tight this year, and Taiwan's component design and development, IC manufacturing, packaging and testing industries can also be exposed.
Regarding the global follow-up of IoT business opportunities, Peng Maorong quoted IEK's estimates as saying that the market size still needs to be expanded due to the fact that some specifications and agreements have not yet been finalized. It is estimated that the number of IoT installations in the world this year will be about 14.4 billion sets. By 2018, as the specification is more complete, the number of IoT installations is expected to grow to 34.8 billion units. Among them, the demand for semiconductor components (such as sensor and power management IC) required in the IoT device will rapidly increase with the growth of the IoT market.
According to IEK estimates, this year IoT global sensors (including MEMS, optical sensor components) and power management ICs worth about $42.5 billion, and are expected to grow to $60.7 billion by 2018.
Peng Maorong further analyzed that the characteristics of IoT are to emphasize user convenience and product diversity (lightweight, low-cost, power-saving), rather than simply pursuing performance, while the main structure of IoT is object sensing, communication transmission, The cloud computing consists of. He believes that the future development of IoT will focus on the development of power management ICs and sensors. Among them, the sensor is the first information collection component of IoT, and the continuous evolution of power management IC is expected to meet the IoT power saving. demand. Observing the end of the 2014 CES exhibition, you can also find that applications such as wearable devices and IoT are a highlight.
Because of the IoT-driven sensors, power management ICs and other products, it can only be produced in a mature process of 90 nm or even 0.13 micron. It is expected to be a re-ignition opportunity for the 8-inch factory. IC manufacturing, packaging and testing industry will also be able to wet the rain.
Peng Maorong pointed out that TSMC (2330) is actually not only actively working on advanced processes, but also has launched special process upgrades for four 8-inch factories to attack related business opportunities. As for the world of TSMC (5347), it is now interested in acquiring the 8 inch wafer fab of Shengke (2408) and the 6-inch fab Yuanlong. In addition to the market for fingerprint identification related ICs, IoT may be cut. It is also another important consideration.
Gold Finger Pcb,Flexible Circuit Board Gold Finger,Circuit Board Gold Finger Plating,Gold Finger Circuit Board
Shenzheng Weifu Circuit Technology Co.Ld , https://www.wfcircuit.com